XERON intends to enter the European market with a broad PC hardware portfolio and is using Gamescom 2026 in Cologne as its first official appearance in Europe. In addition to cases, power supplies, cooling solutions and thermal interface products, the manufacturer is announcing the market launch of the NEX L360 ARGB, a 360-mm all-in-one liquid cooler for current Intel and AMD desktop platforms. The available information comes from two manufacturer press releases, with the later publication dated August 27, 2026 describing the technical specifications of the NEX L360 ARGB in greater detail than the general product overview from August 3.
According to its own information, XERON is a PC hardware manufacturer based in Beijing, China, and describes Gamescom 2026 as the brand’s first appearance in Europe. According to the announcement dated August 3, the booth is located in Hall 03.2, booth F-049g. The trade fair will take place from August 26 to 30, 2026, at the Koelnmesse exhibition grounds. In addition to presenting its products, the appearance is explicitly intended to seek European distributors, retailers and other channel partners. The announced product range includes PC cases, power supplies, all-in-one liquid coolers, fans, as well as liquid-metal and thermal pastes. The C-LAB Art Gallery case is highlighted as a particularly striking enthusiast model, but the supplied documents do not contain specific information on dimensions, supported motherboard formats or the intended retail price.
NEX L360 ARGB with 360-mm radiator and AM5 offset mounting bracket
The NEX L360 ARGB is offered in black and white variants and is designed for Intel sockets LGA1851, LGA1700, LGA1200 and LGA115X, as well as AMD AM5 and AM4. The scope of delivery includes an offset mounting bracket for AM5, which, according to XERON, is intended to position the contact surface more precisely over the particularly thermally stressed area of the processor. The manufacturer describes this alignment as a measure for optimizing cooling performance, but the detailed product release does not provide any independent test results.
The cooling solution consists of an aluminum radiator with the specified dimensions of 396 × 120 × 27 millimeters. According to the data sheet, 20 millimeters of this are attributable to the radiator core; the remaining millimeters result from the complete assembly. The connection to the pump housing is made via 400-millimeter hoses, with XERON using a low-evaporation fluid line. The nominal thermal design is specified as up to 300 watts TDP. This figure is a manufacturer classification and does not replace a standardized, cross-platform comparable cooling performance measurement. The pump unit measures 72.9 × 72.9 × 67 millimeters and operates with a three-phase motor featuring six slots. Its speed can be controlled via PWM between 800 and 2500 rpm, while the specified noise level is no more than 30 dB(A). XERON lists a four-pin PWM connector, and the pump’s power consumption is specified as 4.2 watts at 12 volts. The pump cover is fully illuminated with addressable RGB LEDs and is intended to provide even, glare-free illumination. The lighting is controlled via a standard 5-volt ARGB connector on the motherboard; XERON does not list a proprietary controller of its own in the supplied technical specifications.
The scope of delivery includes three 120-mm fans with interconnected fan blades. The design is intended to increase blade stiffness and reduce resonances during operation, although the press release describes this effect as a development objective of the manufacturer. A hollowed-out frame is intended to allow more light to pass through the fan blades, while the daisy-chain wiring routes the cables partially through the fan frame and is therefore intended to simplify cable management. The fans rotate at 800 to 2400 rpm and, according to the data sheet, achieve an airflow of up to 75.39 CFM and a static pressure of 2.71 mmH2O. The maximum noise level is specified as 34.9 dB(A), and Hydro Bearings are used. The values apply to one fan in each case and are manufacturer specifications; the sources do not state a measurement method or test setup.
Broader range with power supplies, cooling solutions and thermal interface products
The NEX L360 ARGB is only one part of the portfolio announced for Gamescom. The power supply range extends from compact SFX models to solutions for high-performance multi-GPU systems. The fully modular LUX-PT series is described as an ATX-3.1 line with 750, 850, 1000 and 1200 watts, as well as 80 PLUS Titanium and PPLP Titanium certification. For AI workstations and professional systems, the LUX-PT-WS series includes models with 1650 and 2500 watts, as well as multiple 12V-2×6 connectors.
XERON positions the MAX-PG series below these models, with 650, 750 and 850 watts, which according to the manufacturer achieves 80 PLUS Gold, Cybenetics Gold and PPLP Gold. The MAX-PB series covers 550 to 850 watts and is specified with 80 PLUS 230V EU Bronze. For compact systems, the fully modular MAX-PS models in SFX12V-4.1 and ATX12V-3.1 formats with 650 to 1000 watts are intended, along with the MAX-PX series with 80 PLUS Platinum certification and 750 to 1000 watts. As a flagship model for AI servers, XERON names the MAX P3000G WS with 3000 watts, multiple 12V-2×6 connectors and 80 PLUS Gold certification.
Among its other cooling solutions, XERON lists the LUX L360 VISION with a curved 6.67-inch OLED display, an Infinity Mirror element and 2400-rpm fans. In the older portfolio overview, the NEX L360 ARGB is advertised with an offset copper cooler mounting bracket and a possible temperature reduction of 2 to 3 °C compared with standard coolers. The later product-specific release does not mention this temperature difference and also contains no comparative measurements. It should therefore be classified as a manufacturer claim rather than a proven test result.
Above the NEX series, XERON positions the T1000 as a flagship model with a cooler plate made of a copper-diamond composite and separate fluid circuits for liquid metal and conventional coolant. The manufacturer refers to a result 1.5 to 2.5 times better than that of a solid copper plate and approximately 5 °C lower CPU temperatures under comparable conditions. Since the supplied sources specify neither the test platform nor the measurement method, load scenario or comparison cooler, these values cannot be independently assessed editorially.
The range is supplemented by the MAX-F120 fan series with doubly curved blades and a single-cable design, the NEX-F120A and NEX-F120RA fans for normal and reverse airflow directions, as well as several thermal interface products. The LUX E71 is specified as a liquid metal with a thermal conductivity of 26 W/m·K. The MAX E72 is intended to combine liquid metal with conventional thermal paste and, according to the manufacturer, achieve a thermal conductivity of more than 8 W/m·K. The electrically non-conductive NEX-E72 and NEX-E75 thermal pastes are intended for motherboards, graphics cards and notebooks.
Prices and classification
For the NEX L360 ARGB, XERON lists a recommended retail price of US$74.99 for the black version and US$79.99 for the white variant. The surcharge for the white version is therefore US$5. The remaining prices in the portfolio overview range from US$46.99 for a 550-watt model in the MAX-PB series to US$499 for the 3000-watt MAX P3000G WS power supply. No prices have yet been specified for several series, including the C-LAB case, LUX PT WS, MAX PG and the SFX models. The technical specifications of the NEX L360 ARGB are generally clearly defined for a modern 360-mm AIO, particularly through support for LGA1851 and AM5, the AM5 offset mounting bracket, the 20-millimeter-thick radiator core and the specified fan and pump ranges. However, important points for a reliable assessment remain open, such as the specific socket coverage of the base plate, the cold-plate structure used, the warranty conditions, actual availability in European retail channels and cooling performance under standardized loads. The noise specifications are also initially only data-sheet values, as the sources do not state the measurement conditions.
Conclusion
XERON is using Gamescom 2026 as its entry point into the European market and is presenting an unusually broad range that extends from compact power supplies to a 3000-watt solution for AI servers. The focus of the specific product announcement is the NEX L360 ARGB, which targets current gaming and enthusiast systems with a 360-mm radiator, addressable lighting, interconnected fan blades, a PWM-controlled pump and an AM5 offset mounting bracket. Based on the press releases, it is not yet possible to determine whether the announced features can compete in practice with established 360-mm AIOs. Independent temperature and noise measurements are lacking, as are details on European availability and actual sales conditions. For now, it is clear that XERON has announced a comparatively low-priced 360-mm model with the NEX L360 ARGB and is simultaneously attempting to establish itself in the European PC hardware market with a significantly broader portfolio.
